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1 : $1.8180
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Texas Instruments TP3067BN
IC COMBO CODEC/FILTER 20-DIP
Manufacturer # :TP3067BN
Manufacturer :Texas Instruments
Dasenic # :TP3067BN-DS
Datasheet :
TP3067BN Datasheet
TP3067BN DatasheetCustomer # :
Description : IC COMBO CODEC/FILTER 20-DIP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 1.8180 | $ 1.82 |
| 25+ | $ 1.7820 | $ 44.55 |
| 100+ | $ 1.7100 | $ 171 |
| 500+ | $ 1.6380 | $ 819 |
| 1000+ | $ 1.5480 | $ 1548 |
In Stock: 3042
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.818
Total :$ 1.82
Delivery :
Payment :
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TP3067BN information
Texas Instruments TP3067BN technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Interface - CODECs
- Product Status:Obsolete
- Operating Temperature:0°C ~ 70°C
- Mounting Type:Through Hole
- Package / Case:20-DIP (0.300", 7.62mm)
- Type:PCM, Filter
- Supplier Device Package:20-PDIP
- Resolution ( Bits):8 b
- Data Interface:Serial
- Voltage - Supply, Analog:4.75V ~ 5.25V
- Voltage - Supply, Digital:4.75V ~ 5.25V
- Number of A D Cs / D A Cs:1 / 1
- Sigma Delta:No
- Base Product Number:TP3067
- Packaging:Tube
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.31.0001
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
TP3067BN provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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