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Texas Instruments TNETV6437INZWTQ5
Manufacturer # :TNETV6437INZWTQ5
Manufacturer :Texas Instruments
Dasenic # :TNETV6437INZWTQ5-DS
Datasheet : TNETV6437INZWTQ5 Datasheet
Customer # :
Description : DAVINCI DIGITAL MEDIA SYSTEM-ON-
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In Stock: 2873
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 74.8711
Total :$ 74.87
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TNETV6437INZWTQ5 information
Texas Instruments TNETV6437INZWTQ5 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Embedded - DSP (Digital Signal Processors)
- Product Status:Active
- Operating Temperature:-40°C ~ 125°C (TJ)
- Mounting Type:Surface Mount
- Package / Case:361-LFBGA
- Type:Fixed Point
- Interface:HPI, I²C, McASP, McBSP, PCI, UART, 10/100 Ethernet MAC
- Supplier Device Package:361-NFBGA (16x16)
- Clock Rate:500MHz
- Non- Volatile Memory:ROM (64kB)
- On- Chip R A M:240kB
- Voltage - I/ O:1.8V, 3.3V
- Voltage - Core:1.05V, 1.20V
- EU RoHS Status:ROHS3 Compliant
- REACH Status:REACH Unaffected
- US ECCN:3A991A2
- HTS US:8542.31.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
TNETV6437INZWTQ5 provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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