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Texas Instruments TMX320F28377DZWTT
Manufacturer # :TMX320F28377DZWTT
Manufacturer :Texas Instruments
Dasenic # :TMX320F28377DZWTT-DS
Datasheet : TMX320F28377DZWTT Datasheet
Customer # :
Description : IC MCU 32BIT 1MB FLASH 337NFBGA
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In Stock: 1817
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
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Unit Price :$ 55.7153
Total :$ 55.72
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TMX320F28377DZWTT information
Texas Instruments TMX320F28377DZWTT technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Microcontroller, Microprocessor, FPGA Modules
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 105°C (TA)
- Mounting Type:Surface Mount
- Package / Case:337-LFBGA
- Supplier Device Package:337-NFBGA (16x16)
- Peripherals:POR, PWM, WDT
- Number of I/ O:169
- Speed:200MHz
- E E P R O M Size:-
- Core Processor:C28x
- R A M Size:102K x 16
- Program Memory Type:Flash
- Core Size:32-Bit Dual-Core
- Connectivity:CANbus, EBI/EMI, I²C, McBSP, SCI, SPI, uPP, UART/USART, USB
- Program Memory Size:1MB (512K x 16)
- Voltage - Supply ( Vcc/ Vdd):1.14V ~ 3.47V
- Data Converters:A/D 24x12b, 12x16b; D/A 3x12b
- Oscillator Type:Internal
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:3A991A2
- HTS US:8542.31.0001
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
TMX320F28377DZWTT provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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