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Texas Instruments TMX320DM355ZCE270
Manufacturer # :TMX320DM355ZCE270
Manufacturer :Texas Instruments
Dasenic # :TMX320DM355ZCE270-DS
Datasheet : TMX320DM355ZCE270 Datasheet
Customer # :
Description : IC DIGITAL MEDIA SOC 337-NFBGA
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In Stock: 1334
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 53.7107
Total :$ 53.71
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TMX320DM355ZCE270 information
Texas Instruments TMX320DM355ZCE270 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Embedded - DSP (Digital Signal Processors)
- Product Status:Obsolete
- Operating Temperature:0°C ~ 85°C (TC)
- Mounting Type:Surface Mount
- Package / Case:337-LFBGA
- Type:Digital Media System-on-Chip (DMSoC)
- Interface:ASP, I²C, SPI, UART, USB
- Supplier Device Package:337-BGA (13x13)
- Clock Rate:270MHz
- Non- Volatile Memory:ROM (8kB)
- On- Chip R A M:56kB
- Voltage - I/ O:1.8V, 3.3V
- Voltage - Core:1.30V
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:3A991A2
- HTS US:8542.31.0001
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
TMX320DM355ZCE270 provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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