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Texas Instruments TMX320C6472CZTZ7

IC DSP FIXED POINT 737FCBGA
part number has RoHS
Manufacturer # :TMX320C6472CZTZ7
Manufacturer :Texas Instruments
Dasenic # :TMX320C6472CZTZ7-DS
Customer # :
Description : IC DSP FIXED POINT 737FCBGA
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 2.4840$ 2.48
10+$ 2.3598$ 23.6
100+$ 2.2356$ 223.56
1000+$ 2.1114$ 2111.4
10000+$ 1.9872$ 19872
In Stock: 12029
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 2.484
Total :$ 2.48
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TMX320C6472CZTZ7 information

  • Texas Instruments TMX320C6472CZTZ7 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Embedded - DSP (Digital Signal Processors)
  • Product Status:Obsolete
  • Operating Temperature:0°C ~ 85°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:737-BFBGA, FCBGA
  • Type:Fixed Point
  • Interface:Ethernet MAC, Host Interface, I²C, Telecom, UTPOIA
  • Supplier Device Package:737-FCBGA (24x24)
  • Clock Rate:700MHz
  • Non- Volatile Memory:ROM (768kB)
  • On- Chip R A M:1.44MB
  • Voltage - I/ O:1.8V, 3.3V
  • Voltage - Core:1.20V
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:4 (72 Hours)
  • REACH Status:REACH Unaffected
  • US ECCN:3A991A2
  • HTS US:8542.31.0001
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
TMX320C6472CZTZ7 provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips. TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems. We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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