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Texas Instruments TMUX154EDGSR
Manufacturer # :TMUX154EDGSR
Manufacturer :Texas Instruments
Dasenic # :TMUX154EDGSR-DS
Datasheet : TMUX154EDGSR Datasheet
Customer # :
Description : IC SWITCH SPDT DUAL 10VSSOP
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In Stock: 11348
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.63
Total :$ 0.63
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TMUX154EDGSR information
Texas Instruments TMUX154EDGSR technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Interface - Analog Switches, Multiplexers, Demultiplexers
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C
- Mounting Type:Surface Mount
- Package / Case:10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
- Supplier Device Package:10-VSSOP
- Number of Circuits:2
- Multiplexer/ Demultiplexer Circuit:2:1
- Switch Circuit:SPDT
- On- State Resistance ( Max):10Ohm
- Voltage - Supply, Single ( V+):3V ~ 4.3V
- Voltage - Supply, Dual ( V±):-
- -3db Bandwidth:900MHz
- Channel-to- Channel Matching (Δ Ron):350mOhm
- Switch Time ( Ton, Toff) ( Max):30ns, 25ns
- Charge Injection:-
- Channel Capacitance ( C S(off), C D(off)):2pF, 7.5pF
- Current - Leakage ( I S(off)) ( Max):1µA
- Crosstalk:-97dB @ 1MHz
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
TMUX154EDGSR provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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