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Texas Instruments TMS5703135CZWTQQ1
IC MCU 16/32B 3MB FLASH 337NFBGA
Manufacturer # :TMS5703135CZWTQQ1
Manufacturer :Texas Instruments
Dasenic # :TMS5703135CZWTQQ1-DS
Datasheet :
TMS5703135CZWTQQ1 Datasheet
TMS5703135CZWTQQ1 DatasheetCustomer # :
Description : IC MCU 16/32B 3MB FLASH 337NFBGA
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| Quantity | Unit Price | Total |
| 1+ | $ 40.7718 | $ 40.77 |
In Stock: 13
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
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Unit Price :$ 40.7718
Total :$ 40.77
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TMS5703135CZWTQQ1 information
Texas Instruments TMS5703135CZWTQQ1 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Microcontroller, Microprocessor, FPGA Modules
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 125°C (TA)
- Mounting Type:Surface Mount
- Package / Case:337-LFBGA
- Supplier Device Package:337-NFBGA (16x16)
- Peripherals:DMA, POR, PWM, WDT
- Number of I/ O:120
- Speed:180MHz
- E E P R O M Size:64K x 8
- Core Processor:ARM® Cortex®-R4F
- R A M Size:256K x 8
- Program Memory Type:Flash
- Core Size:16/32-Bit
- Connectivity:CANbus, EBI/EMI, FlexRay, I²C, LINbus, MibSPI, SCI, SPI, UART/USART
- Program Memory Size:3MB (3M x 8)
- Voltage - Supply ( Vcc/ Vdd):1.14V ~ 3.6V
- Data Converters:A/D 24x12b
- Oscillator Type:External
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:3A991A2
- HTS US:8542.31.0001
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
TMS5703135CZWTQQ1 provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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