Name: TMS5701227BPGEQQ1
Brand: Texas Instruments
SKU: DS-5609989
Price: 38.7297 USD
Availability: InStock
Rating: 4.8 (3 reviews)

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Texas Instruments TMS5701227BPGEQQ1

IC MCU 32BIT 1.25MB FLSH 144LQFP

Manufacturer # :TMS5701227BPGEQQ1

Manufacturer :Texas Instruments

Dasenic # :TMS5701227BPGEQQ1-DS

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TMS5701227BPGEQQ1 Datasheet

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Description : IC MCU 32BIT 1.25MB FLSH 144LQFP

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In Stock: 6221

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TMS5701227BPGEQQ1 information

Texas Instruments TMS5701227BPGEQQ1 technical specifications, attributes, parameters.
Category:Integrated Circuits (ICs)/Embedded - Microcontrollers
Product Status:Obsolete
Operating Temperature:-40°C ~ 125°C (TA)
Mounting Type:Surface Mount
Package / Case:144-LQFP
Supplier Device Package:144-LQFP (20x20)
Peripherals:DMA, POR, PWM, WDT
Number of I/ O:58
Speed:160MHz
E E P R O M Size:64K x 8
Core Processor:ARM® Cortex®-R4F
R A M Size:192K x 8
Program Memory Type:Flash
Core Size:32-Bit Dual-Core
Connectivity:CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, MibSPI, SPI, UCI, UART/USART
Program Memory Size:1.25MB (1.25M x 8)
Voltage - Supply ( Vcc/ Vdd):1.14V ~ 3.6V
Data Converters:A/D 24x12b
Oscillator Type:External
EU RoHS Status:ROHS3 Compliant
MSL Rating:3 (168 Hours,30°C/60%RH)
REACH Status:REACH Unaffected
US ECCN:3A991A2
HTS US:8542.31.0001
China RoHS Status:Orange Symbol: Safe for use during the environmental protection period

Download datasheets and manufacturer documentation for Texas Instruments TMS5701227BPGEQQ1
Datasheet:
TMS5701227BPGEQQ1,

Texas Instruments TMS5701227BPGEQQ1 Environmental and export classification status description
Overview of Texas Instruments TMS5701227BPGEQQ1: The Texas Instruments TMS5701227BPGEQQ1 is a microcontroller from the TMS570 family, specifically designed for automotive applications. It features high processing power and a wide range of integrated peripherals ideal for safety-critical automotive systems. Functions: - High-performance ARM Cortex-R5F core - Integrated Memory Protection Unit (MPU) - Integrated DSP functionality - Integrated Error Correction Code (ECC) on the flash memory - Hardware Security Module - Integrated Peripheral Interfaces Applications: - Automotive Safety Systems (such as airbags, braking systems, steering control) - Advanced Driver Assistance Systems (ADAS) - Automotive Infotainment Systems - Industrial Control Systems - Medical Devices Alternative Components: - Infineon AURIX™ Microcontrollers - NXP i.MX family of Microcontrollers - Renesas RH850 microcontrollers - STMicroelectronics STM32 family of Microcontrollers Embedded Modules: - CAN (Controller Area Network) module - Ethernet controller - ADC (Analog-to-Digital Converter) - PWM (Pulse Width Modulation) modules - SPI (Serial Peripheral Interface) modules - FlexRay communication interface Related Q&A: 1. What are the key features of the Texas Instruments TMS5701227BPGEQQ1 microcontroller? 2. How does the ECC functionality on the flash memory of the TMS5701227BPGEQQ1 contribute to system reliability in automotive applications? 3. What advantages does the integrated hardware security module of the TMS5701227BPGEQQ1 offer in terms of system security? 4. Can the TMS5701227BPGEQQ1 be used in both motor control and vehicle networking applications? 5. What are the main differences between the TMS5701227BPGEQQ1 and other microcontrollers in the automotive market, such as the Infineon AURIX™ family?

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TMS5701227BPGEQQ1 provided by Texas Instruments

Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips. TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems. We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.