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Texas Instruments TMS370C712ANT
Manufacturer # :TMS370C712ANT
Manufacturer :Texas Instruments
Dasenic # :TMS370C712ANT-DS
Datasheet : TMS370C712ANT Datasheet
Customer # :
Description : IC MCU 8BIT 8KB OTP 40DIP
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In Stock: 32670
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 8.649
Total :$ 8.65
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TMS370C712ANT information
Texas Instruments TMS370C712ANT technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Microcontroller, Microprocessor, FPGA Modules
- Product Status:Active
- Package / Case:40-DIP (0.600, 15.24mm)
- Peripherals:PWM, WDT
- Speed:5MHz
- Connectivity:SPI
- Series:TMS370
- Mounting Type:Through Hole
- Operating Temperature:-40°C ~ 105°C (TA)
- Core Processor:TMS370
- R A M Size:256 x 8
- Numberof I/ O:22
- Program Memory Type:OTP
- Core Size:8-Bit
- E E P R O M Size:256 x 8
- Program Memory Size:8KB (8K x 8)
- Voltage- Supply( Vcc/ Vdd):4.5V ~ 5.5V
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
TMS370C712ANT provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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