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  • Texas Instruments TMS320LC549GGUR-80

    IC FIXED POINT DSP 144-BGA
  • part number has RoHS
  • Mfr.Part # :TMS320LC549GGUR-80
  • Manufacturer :Texas Instruments
  • Dasenic # :TMS320LC549GGUR-80-DS
  • Datasheet :pdf download TMS320LC549GGUR-80 Datasheet
  • Description : IC FIXED POINT DSP 144-BGA
  • Package :-
  • Quantity :
    Unit Price : $ 98.1956Total : $ 98.20
  • Delivery Time :Ship Within 48 Hours
  • Shipping Origin :Shenzhen or Hong Kong Warehouse
  • Delivery :
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  • Payment :
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In Stock: 2546
( MOQ : 1 PCS )
Pricing (USD) : * All prices are in USD
QuantityUnit PriceTotal
10 +$ 98.1956$ 981.96
1000 +$ 65.4637$ 65463.70

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Texas Instruments TMS320LC549GGUR-80 technical specifications, attributes, parameters.
Category:Integrated Circuits (ICs)/DSP (Digital Signal Processors)
Product Status:Obsolete
Operating Temperature:-40°C ~ 100°C (TC)
Mounting Type:Surface Mount
Package / Case:144-LFBGA
Type:Fixed Point
Interface:BSP, Host Interface
Supplier Device Package:144-BGA MICROSTAR (12x12)
Clock Rate:80MHz
Non- Volatile Memory:ROM (32kB)
On- Chip R A M:64kB
Voltage - I/ O:3.30V
Voltage - Core:3.30V
EU RoHS Status:RoHS non-compliant
MSL Rating:1 (Unlimited, 30°C/85%RH)
REACH Status:REACH Unaffected
US ECCN:3A991A2
HTS US:8542.31.0001
China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
TMS320LC549GGUR-80 provided by Texas Instruments

Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.

TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.

We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.

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