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Texas Instruments TMS320F28076PZPS
Manufacturer # :TMS320F28076PZPS
Manufacturer :Texas Instruments
Dasenic # :TMS320F28076PZPS-DS
Datasheet : TMS320F28076PZPS Datasheet
Customer # :
Description : C2000™ 32-bit MCU with 120 MHz, FPU, TMU, 512 KB flash, CLA, CLB, SDFM
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In Stock: 1631
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 15.516
Total :$ 15.52
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Payment :
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TMS320F28076PZPS information
Texas Instruments TMS320F28076PZPS technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Microcontroller, Microprocessor, FPGA Modules
- Product Status:Active
- Package / Case:100-TQFP Exposed Pad
- Peripherals:DMA, POR, PWM, WDT
- Speed:120MHz
- Connectivity:CANbus, EBI/EMI, I²C, McBSP, SCI, SPI, UART/USART, USB
- Series:C2000™ C28x Piccolo™, Functional Safety (FuSa)
- Operating Temperature:-40°C ~ 125°C (TJ)
- Core Processor:C28x
- R A M Size:50K x 16
- Numberof I/ O:41
- Program Memory Type:Flash
- Core Size:32-Bit Single-Core
- Data Converters:A/D 14x12b; D/A 3x12b
- Oscillator Type:External
- Program Memory Size:512KB (256K x 16)
- Voltage- Supply( Vcc/ Vdd):1.14V ~ 3.47V
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
TMS320F28076PZPS provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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