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Texas Instruments TMS320F28067PZPQ
Manufacturer # :TMS320F28067PZPQ
Manufacturer :Texas Instruments
Dasenic # :TMS320F28067PZPQ-DS
Datasheet : TMS320F28067PZPQ Datasheet
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Description : Automotive C2000™ 32-bit MCU with 90 MHz, FPU, 256 KB flash, 100 KB RAM
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In Stock: 1504
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
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Unit Price :$ 37.24
Total :$ 37.24
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TMS320F28067PZPQ information
Texas Instruments TMS320F28067PZPQ technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Embedded - Microcontrollers
- Product Status:Active
- Operating Temperature:-40°C ~ 125°C (TA)
- Mounting Type:Surface Mount
- Package / Case:100-TQFP Exposed Pad
- Supplier Device Package:100-HTQFP (14x14)
- Peripherals:Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/ O:54
- Speed:90MHz
- Core Processor:C28x
- R A M Size:50K x 16
- Program Memory Type:Flash
- Core Size:32-Bit Single-Core
- Connectivity:CANbus, I²C, McBSP, SCI, SPI, UART/USART
- Program Memory Size:256KB (128K x 16)
- Voltage - Supply ( Vcc/ Vdd):1.71V ~ 1.995V
- Data Converters:A/D 16x12b
- Oscillator Type:Internal
- Series:Automotive, AEC-Q100, C2000™ C28x Piccolo™
- Base Product Number:TMS320
- Packaging:Tray
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:3A991A2
- HTS US:8542.31.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
TMS320F28067PZPQ provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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