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Texas Instruments TMS320F28054FPNS
Manufacturer # :TMS320F28054FPNS
Manufacturer :Texas Instruments
Dasenic # :TMS320F28054FPNS-DS
Datasheet : TMS320F28054FPNS Datasheet
Customer # :
Description : IC MCU 32BIT 128KB FLASH 80LQFP
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In Stock: 631
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
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Unit Price :$ 18.2368
Total :$ 18.24
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TMS320F28054FPNS information
Texas Instruments TMS320F28054FPNS technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Microcontroller, Microprocessor, FPGA Modules
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 125°C (TA)
- Mounting Type:Surface Mount
- Package / Case:80-LQFP
- Supplier Device Package:80-LQFP (12x12)
- Peripherals:Brown-out Detect/Reset, POR, PWM, WDT
- Number of I/ O:42
- Speed:60MHz
- E E P R O M Size:-
- Core Processor:C28x
- R A M Size:8K x 16
- Program Memory Type:Flash
- Core Size:32-Bit Single-Core
- Connectivity:CANbus, I²C, SCI, SPI, UART/USART
- Program Memory Size:128KB (64K x 16)
- Voltage - Supply ( Vcc/ Vdd):1.71V ~ 1.995V
- Data Converters:A/D 16x12b
- Oscillator Type:Internal
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
TMS320F28054FPNS provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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