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  • Texas Instruments TMS320C6711GFN150

    IC FLOATING POINT DSP 256-BGA
  • part number has RoHS
  • Mfr.Part # :TMS320C6711GFN150
  • Manufacturer :Texas Instruments
  • Dasenic # :TMS320C6711GFN150-DS
  • Datasheet :pdf download TMS320C6711GFN150 Datasheet
  • Description : IC FLOATING POINT DSP 256-BGA
  • Package :-
  • Quantity :
    Unit Price : $ 94.63Total : $ 94.63
  • Delivery Time :Ship Within 48 Hours
  • Shipping Origin :Shenzhen or Hong Kong Warehouse
  • Delivery :
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In Stock: 894
( MOQ : 1 PCS )
Pricing (USD) : * All prices are in USD
QuantityUnit PriceTotal
40 +$ 94.6300$ 3785.20

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Texas Instruments TMS320C6711GFN150 technical specifications, attributes, parameters.
Category:Integrated Circuits (ICs)/DSP (Digital Signal Processors)
Product Status:Obsolete
Operating Temperature:0°C ~ 90°C (TC)
Mounting Type:Surface Mount
Package / Case:256-BGA
Type:Floating Point
Interface:Host Interface, McBSP
Supplier Device Package:256-BGA (27x27)
Clock Rate:150MHz
Non- Volatile Memory:External
On- Chip R A M:72kB
Voltage - I/ O:3.30V
Voltage - Core:1.90V
EU RoHS Status:RoHS Compliant
REACH Status:Vendor is not defined
US ECCN:Provided as per user requirements
China RoHS Status:Green Symbol: Green and environmentally friendly product
TMS320C6711GFN150 provided by Texas Instruments

Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.

TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.

We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.

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