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  • Texas Instruments TLV809EC26DBZR

    IC SUPERVISOR 1 CHANNEL SOT23-3
  • part number has RoHS
  • Mfr.Part # :TLV809EC26DBZR
  • Manufacturer :Texas Instruments
  • Dasenic # :TLV809EC26DBZR-DS
  • Datasheet :pdf download TLV809EC26DBZR Datasheet
  • Description : IC SUPERVISOR 1 CHANNEL SOT23-3
  • Package :-
  • Quantity :
    Unit Price : $ 0.387Total : $ 0.39
  • Delivery Time :Ship Within 48 Hours
  • Shipping Origin :Shenzhen or Hong Kong Warehouse
  • Delivery :
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  • Payment :
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In Stock: 11277
( MOQ : 1 PCS )
Pricing (USD) : * All prices are in USD
QuantityUnit PriceTotal
1 +$ 0.3870$ 0.39
10 +$ 0.2403$ 2.40
100 +$ 0.1926$ 19.26
500 +$ 0.1836$ 91.80
1000 +$ 0.1728$ 172.80

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Texas Instruments TLV809EC26DBZR technical specifications, attributes, parameters.
Category:Integrated Circuits (ICs)/Supervisors
Product Status:Active
Operating Temperature:-40°C ~ 125°C (TJ)
Mounting Type:Surface Mount
Package / Case:TO-236-3, SC-59, SOT-23-3
Type:Simple Reset/Power-On Reset
Supplier Device Package:SOT-23-3
Output:Push-Pull, Totem Pole
Reset:Active Low
Number of Voltages Monitored:1
Voltage - Threshold:2.64V
Reset Timeout:6.5ms Minimum
EU RoHS Status:ROHS3 Compliant
MSL Rating:1 (Unlimited, 30°C/85%RH)
REACH Status:REACH Unaffected
US ECCN:EAR99
HTS US:8542.39.0001
China RoHS Status:Green Symbol: Green and environmentally friendly product
TLV809EC26DBZR provided by Texas Instruments

Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.

TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.

We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.

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