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Texas Instruments TLV5623CDGKG4
Manufacturer # :TLV5623CDGKG4
Manufacturer :Texas Instruments
Dasenic # :TLV5623CDGKG4-DS
Datasheet : TLV5623CDGKG4 Datasheet
Customer # :
Description : IC 8 BIT 3US DAC S/O 8VSSOP
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In Stock: 1525
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.647
Total :$ 1.65
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TLV5623CDGKG4 information
Texas Instruments TLV5623CDGKG4 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Data Acquisition - Digital to Analog Converters (DAC)
- Product Status:Active
- Package / Case:8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- Supplier Device Package:8-VSSOP
- Architecture:String DAC
- Operating Temperature:0°C ~ 70°C
- Data Interface:SPI
- Numberof Bits:8
- Voltage- Supply Analog:2.7V ~ 3.3V, 5V
- Voltage- Supply Digital:2.7V ~ 3.3V, 5V
- Reference Type:External
- Output Type:Voltage - Buffered
- I N L/ D N L( L S B):±0.3, ±0.07
- Settling Time:20µs
- Differential Output:No
- Numberof D/ A Converters:1
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
TLV5623CDGKG4 provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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