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Texas Instruments TLV320DAC3202CYZJR

IC AMP CLASS G STEREO 20DSBGA
part number has RoHS
Manufacturer # :TLV320DAC3202CYZJR
Manufacturer :Texas Instruments
Dasenic # :TLV320DAC3202CYZJR-DS
Customer # :
Description : IC AMP CLASS G STEREO 20DSBGA
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 1.9530$ 1.95
25+$ 1.9170$ 47.93
100+$ 1.8360$ 183.6
500+$ 1.7640$ 882
1000+$ 1.6650$ 1665
In Stock: 10360
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.953
Total :$ 1.95
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TLV320DAC3202CYZJR information

  • Texas Instruments TLV320DAC3202CYZJR technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Linear - Amplifiers - Audio
  • Product Status:Obsolete
  • Operating Temperature:-30°C ~ 85°C (TA)
  • Features:Depop, I²C, I²S, Short-Circuit and Thermal Protection, Shutdown, Volume Control
  • Mounting Type:Surface Mount
  • Package / Case:20-UFBGA, DSBGA
  • Type:Class G
  • Output Type:Headphones, 2-Channel (Stereo)
  • Supplier Device Package:20-DSBGA
  • Voltage - Supply:2.3V ~ 4.8V
  • Max Output Power x Channels @ Load:-
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:1 (Unlimited, 30°C/85%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:5A991G
  • HTS US:8542.33.0001
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
TLV320DAC3202CYZJR provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips. TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems. We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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