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Texas Instruments TLV320AIC3111IRHBT
Manufacturer # :TLV320AIC3111IRHBT
Manufacturer :Texas Instruments
Dasenic # :TLV320AIC3111IRHBT-DS
Datasheet : TLV320AIC3111IRHBT Datasheet
Customer # :
Description : IC CODEC STER AUDIO 24 BIT 32QFN
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 1815
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 7.803
Total :$ 7.80
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Payment :
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TLV320AIC3111IRHBT information
Texas Instruments TLV320AIC3111IRHBT technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Interface - CODECs
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C
- Mounting Type:Surface Mount
- Package / Case:32-VFQFN Exposed Pad
- Type:Audio
- Supplier Device Package:32-VQFN (5x5)
- Resolution ( Bits):32 b
- Data Interface:I²C, Serial
- Voltage - Supply, Analog:2.7V ~ 3.6V
- Voltage - Supply, Digital:1.65V ~ 1.95V
- Number of A D Cs / D A Cs:1 / 2
- Sigma Delta:Yes
- S/ N Ratio, A D Cs / D A Cs (db) Typ:91 / 95
- Dynamic Range, A D Cs / D A Cs (db) Typ:-
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:2 (1 Year,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
TLV320AIC3111IRHBT provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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