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Texas Instruments TLV320ADC3001IYZHR

IC ADC/AUDIO 24BIT 96K 16DSBGA
part number has RoHS
Manufacturer # :TLV320ADC3001IYZHR
Manufacturer :Texas Instruments
Dasenic # :TLV320ADC3001IYZHR-DS
Customer # :
Description : IC ADC/AUDIO 24BIT 96K 16DSBGA
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 1.3230$ 1.32
25+$ 1.2960$ 32.4
100+$ 1.2420$ 124.2
500+$ 1.1880$ 594
1000+$ 1.1250$ 1125
In Stock: 44581
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.323
Total :$ 1.32
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TLV320ADC3001IYZHR information

  • Texas Instruments TLV320ADC3001IYZHR technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Data Acquisition - ADCs/DACs - Special Purpose
  • Product Status:Active
  • Operating Temperature:-40°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:16-UFBGA, DSBGA
  • Type:ADC, Audio
  • Number of Channels:3
  • Supplier Device Package:16-DSBGA (2.24x2.16)
  • Voltage - Supply:1.65V ~ 1.95V, 2.6V ~ 3.6V
  • Resolution ( Bits):24 b
  • Sampling Rate ( Per Second):96k
  • Data Interface:DSP, I²S
  • Voltage Supply Source:Analog and Digital
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:1 (Unlimited, 30°C/85%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
TLV320ADC3001IYZHR provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips. TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems. We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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