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Texas Instruments TLV2704ID

IC AMP COMP 14SOIC
part number has RoHS
Manufacturer # :TLV2704ID
Manufacturer :Texas Instruments
Dasenic # :TLV2704ID-DS
Customer # :
Description : IC AMP COMP 14SOIC
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 2.2320$ 2.23
25+$ 2.1870$ 54.68
100+$ 2.0970$ 209.7
500+$ 2.0070$ 1003.5
1000+$ 1.8990$ 1899
In Stock: 14700
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 2.232
Total :$ 2.23
Delivery :
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Payment :
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TLV2704ID information

  • Texas Instruments TLV2704ID technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Linear - Amplifiers - Special Purpose
  • Product Status:Active
  • Mounting Type:Surface Mount
  • Package / Case:14-SOIC (0.154", 3.90mm Width)
  • Type:Amplifier, Comparator
  • Supplier Device Package:14-SOIC
  • Applications:Security Systems
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
TLV2704ID provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips. TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems. We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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