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Texas Instruments TLV2474CD
Manufacturer # :TLV2474CD
Manufacturer :Texas Instruments
Dasenic # :TLV2474CD-DS
Datasheet : TLV2474CD Datasheet
Customer # :
Description : IC CMOS 4 CIRCUIT 14SOIC
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In Stock: 5100
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.2763
Total :$ 0.28
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TLV2474CD information
Texas Instruments TLV2474CD technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps
- Product Status:Active
- Operating Temperature:0°C ~ 70°C (TA)
- Mounting Type:Surface Mount
- Package / Case:14-SOIC (0.154", 3.90mm Width)
- Current - Supply:600µA (x4 Channels)
- Output Type:Rail-to-Rail
- Supplier Device Package:14-SOIC
- Number of Circuits:4
- Amplifier Type:CMOS
- -3db Bandwidth:-
- Current - Output / Channel:35 mA
- Slew Rate:1.5V/µs
- Gain Bandwidth Product:2.8 MHz
- Current - Input Bias:2.5 pA
- Voltage - Input Offset:250 µV
- Voltage - Supply Span ( Min):2.7 V
- Voltage - Supply Span ( Max):6 V
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
TLV2474CD provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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