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Texas Instruments TLV2461QDG4
IC OPAMP GP 1 CIRCUIT 8SOIC
Manufacturer # :TLV2461QDG4
Manufacturer :Texas Instruments
Dasenic # :TLV2461QDG4-DS
Datasheet :
TLV2461QDG4 Datasheet
TLV2461QDG4 DatasheetCustomer # :
Description : IC OPAMP GP 1 CIRCUIT 8SOIC
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| Quantity | Unit Price | Total |
| 10+ | $ 2.2318 | $ 22.32 |
| 450+ | $ 1.8598 | $ 836.91 |
In Stock: 1054
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
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Unit Price :$ 2.2318
Total :$ 2.23
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TLV2461QDG4 information
Texas Instruments TLV2461QDG4 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps
- Product Status:Discontinued at Digi-Key
- Operating Temperature:-40°C ~ 125°C
- Mounting Type:Surface Mount
- Package / Case:8-SOIC (0.154", 3.90mm Width)
- Current - Supply:550µA
- Output Type:Rail-to-Rail
- Supplier Device Package:8-SOIC
- Number of Circuits:1
- Amplifier Type:General Purpose
- -3db Bandwidth:-
- Current - Output / Channel:80 mA
- Slew Rate:1.6V/µs
- Gain Bandwidth Product:6.4 MHz
- Current - Input Bias:1.3 nA
- Voltage - Input Offset:500 µV
- Voltage - Supply Span ( Min):2.7 V
- Voltage - Supply Span ( Max):6 V
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Green Symbol: Green and environmentally friendly product
TLV2461QDG4 provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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