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Texas Instruments TLK4201EARGTR

IC INTERFACE SPECIALIZED 16QFN
part number has RoHS
Manufacturer # :TLK4201EARGTR
Manufacturer :Texas Instruments
Dasenic # :TLK4201EARGTR-DS
Customer # :
Description : IC INTERFACE SPECIALIZED 16QFN
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
10+$ 25.8674$ 258.67
3000+$ 14.3708$ 43112.4
In Stock: 725
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 25.8674
Total :$ 25.87
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TLK4201EARGTR information

  • Texas Instruments TLK4201EARGTR technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Interface - Specialized
  • Product Status:Active
  • Mounting Type:Surface Mount
  • Package / Case:16-VFQFN Exposed Pad
  • Interface:2-Wire Serial
  • Supplier Device Package:16-VQFN (3x3)
  • Voltage - Supply:3V ~ 3.6V
  • Applications:Digital High-Speed Link
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
TLK4201EARGTR provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips. TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems. We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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