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  • Texas Instruments TLC352CPWR

    IC DIFF VOLT COMP DUAL 8-TSSOP
  • part number has RoHS
  • Mfr.Part # :TLC352CPWR
  • Manufacturer :Texas Instruments
  • Dasenic # :TLC352CPWR-DS
  • Datasheet :pdf download TLC352CPWR Datasheet
  • Description : IC DIFF VOLT COMP DUAL 8-TSSOP
  • Package :-
  • Quantity :
    Unit Price : $ 1.17Total : $ 1.17
  • Delivery Time :Ship Within 48 Hours
  • Shipping Origin :Shenzhen or Hong Kong Warehouse
  • Delivery :
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  • Payment :
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In Stock: 5850
( MOQ : 1 PCS )
Pricing (USD) : * All prices are in USD
QuantityUnit PriceTotal
1 +$ 1.1700$ 1.17
10 +$ 0.8532$ 8.53
25 +$ 1.1700$ 29.25
100 +$ 0.6843$ 68.43
250 +$ 0.6421$ 160.53

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Texas Instruments TLC352CPWR technical specifications, attributes, parameters.
Category:Integrated Circuits (ICs)/Comparators Linear
Product Status:Active
Operating Temperature:0°C ~ 70°C
Mounting Type:Surface Mount
Package / Case:8-TSSOP (0.173", 4.40mm Width)
Type:Differential
Output Type:CMOS, MOS, Open-Drain, TTL
Supplier Device Package:8-TSSOP
Number of Elements:2
Voltage - Supply, Single/ Dual (±):1.4V ~ 16V, ±0.7V ~ 8V
Voltage - Input Offset ( Max):5mV @ 5V
Current - Input Bias ( Max):5pA @ 5V
Current - Output ( Typ):20mA
Current - Quiescent ( Max):400µA
C M R R, P S R R ( Typ):-
Propagation Delay ( Max):-
Hysteresis:-
EU RoHS Status:RoHS Compliant
REACH Status:REACH is not affected
US ECCN:EAR99
China RoHS Status:Green Symbol: Green and environmentally friendly product
TLC352CPWR provided by Texas Instruments

Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.

TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.

We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.

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