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Texas Instruments TLC320AC01CFNR
Manufacturer # :TLC320AC01CFNR
Manufacturer :Texas Instruments
Dasenic # :TLC320AC01CFNR-DS
Datasheet : TLC320AC01CFNR Datasheet
Customer # :
Description : IC AUDIO BAND CODEC 14BIT 28PLCC
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In Stock: 621
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 16.2866
Total :$ 16.29
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TLC320AC01CFNR information
Texas Instruments TLC320AC01CFNR technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Interface - CODECs
- Product Status:Active
- Operating Temperature:0°C ~ 70°C
- Mounting Type:Surface Mount
- Package / Case:28-LCC (J-Lead)
- Type:Audio
- Supplier Device Package:28-PLCC (11.51x11.51)
- Resolution ( Bits):14 b
- Data Interface:Serial
- Voltage - Supply, Analog:4.5V ~ 5.5V
- Voltage - Supply, Digital:4.5V ~ 5.5V
- Number of A D Cs / D A Cs:1 / 1
- Sigma Delta:No
- S/ N Ratio, A D Cs / D A Cs (db) Typ:-
- Dynamic Range, A D Cs / D A Cs (db) Typ:-
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
TLC320AC01CFNR provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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