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Texas Instruments TL851CNG4
IC SONAR RANGING CONTROL 16-DIP
Manufacturer # :TL851CNG4
Manufacturer :Texas Instruments
Dasenic # :TL851CNG4-DS
Datasheet :
TL851CNG4 Datasheet
TL851CNG4 DatasheetCustomer # :
Description : IC SONAR RANGING CONTROL 16-DIP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 75+ | $ 11.9435 | $ 895.76 |
In Stock: 1366
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 11.9435
Total :$ 11.94
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TL851CNG4 information
Texas Instruments TL851CNG4 technical specifications, attributes, parameters.
- Category:RF and Wireless/RF Misc ICs and Modules
- Product Status:Active
- Mounting Type:Through Hole
- Package / Case:16-DIP (0.300", 7.62mm)
- Frequency:20kHz ~ 90kHz
- Supplier Device Package:16-PDIP
- R F Type:Sonar Control
- Secondary Attributes:Synchronous 4-Bit Gain Control
- Function:Sonar Ranging Control
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
TL851CNG4 provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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