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Texas Instruments TL431IDBVTE4
Manufacturer # :TL431IDBVTE4
Manufacturer :Texas Instruments
Dasenic # :TL431IDBVTE4-DS
Datasheet : TL431IDBVTE4 Datasheet
Customer # :
Description : IC VREF SHUNT ADJ 2.2% SOT23-5
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In Stock: 1499
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.9761
Total :$ 0.98
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Texas Instruments TL431IDBVTE4 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Voltage Reference
- Product Status:Obsolete
- Tolerance:±2.2%
- Temperature Coefficient:-
- Operating Temperature:-40°C ~ 85°C (TA)
- Mounting Type:Surface Mount
- Package / Case:SC-74A, SOT-753
- Current - Supply:-
- Voltage - Input:-
- Output Type:Adjustable
- Supplier Device Package:SOT-23-5
- Reference Type:Shunt
- Current - Output:100 mA
- Voltage - Output ( Min/ Fixed):2.495V
- Voltage - Output ( Max):36 V
- Noise - 0.1 Hz to 10 Hz:-
- Noise - 10 Hz to 10k Hz:-
- Current - Cathode:1 mA
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
TL431IDBVTE4 provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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