Texas Instruments TL16C550DIRHBRG4

Name: TL16C550DIRHBRG4
Brand: Texas Instruments
SKU: TL16C550DIRHBRG4-DS
Price: 7.9085 USD
Availability: InStock
Rating: 4.8 (42 reviews)

in_stock: 1377

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Manufacturer_part :TL16C550DIRHBRG4
Manufacturer :Texas Instruments
Dasenic_Part :TL16C550DIRHBRG4-DS
Datasheet : TL16C550DIRHBRG4 Datasheet PDF
Description : IC ASYNC COMM ELEMENT 32-VQFN
package :-
unit_price: $7.9085
total: $7.91

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Texas Instruments TL16C550DIRHBRG4 technical_specifications

Category:Integrated Circuits (ICs)/UARTs (Universal Asynchronous Receiver Transmitter)

Product Status:Active

Features:-

Mounting Type:Surface Mount

Package / Case:32-VFQFN Exposed Pad

Number of Channels:1, UART

Supplier Device Package:32-VQFN (5x5)

Data Rate ( Max):1Mbps

Voltage - Supply:2.25V ~ 5.5V

Protocol:-

F I F O's:16 Byte

With Auto Flow Control:Yes

With Ir D A Encoder/ Decoder:-

With False Start Bit Detection:Yes

With Modem Control:Yes

EU RoHS Status:ROHS3 Compliant

MSL Rating:2 (1 Year,30°C/60%RH)

REACH Status:REACH Unaffected

US ECCN:EAR99

HTS US:8542.39.0001

China RoHS Status:Green Symbol: Green and environmentally friendly product

TL16C550DIRHBRG4 provided by Texas Instruments

Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.

TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.

We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.