Name: TL16C2550IPFB
Brand: Texas Instruments
SKU: DS-5741463
Price: 3.672 USD
Availability: InStock
Rating: 4.8 (3 reviews)

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Texas Instruments TL16C2550IPFB

IC DUAL UART 16BYTE FIFO 48-TQFP

Manufacturer # :TL16C2550IPFB

Manufacturer :Texas Instruments

Dasenic # :TL16C2550IPFB-DS

Datasheet :

TL16C2550IPFB Datasheet

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Description : IC DUAL UART 16BYTE FIFO 48-TQFP

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Quantity	Unit Price	Total
1+	$ 3.6720	$ 3.67
25+	$ 3.6000	$ 90
100+	$ 3.4560	$ 345.6
500+	$ 3.3030	$ 1651.5
1000+	$ 3.1230	$ 3123

In Stock: 6492

MOQ :1 PCS

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Delivery Time :Ship Within 48 Hours

Shipping Origin :Shenzhen or Hong Kong Warehouse

Quantity :

Unit Price :$ 3.672

Total :$ 3.67

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TL16C2550IPFB information

Texas Instruments TL16C2550IPFB technical specifications, attributes, parameters.
Category:Integrated Circuits (ICs)/Interface - UARTs (Universal Asynchronous Receiver Transmitter)
Product Status:Active
Features:Internal Oscillator
Mounting Type:Surface Mount
Package / Case:48-TQFP
Number of Channels:2, DUART
Supplier Device Package:48-TQFP (7x7)
Data Rate ( Max):1.5Mbps
Voltage - Supply:1.8V ~ 5V
Protocol:-
F I F O's:16 Byte
With Auto Flow Control:Yes
With Ir D A Encoder/ Decoder:-
With False Start Bit Detection:Yes
With Modem Control:Yes
EU RoHS Status:ROHS3 Compliant
MSL Rating:2 (1 Year,30°C/60%RH)
REACH Status:REACH Unaffected
US ECCN:EAR99
HTS US:8542.39.0001
China RoHS Status:Green Symbol: Green and environmentally friendly product

Download datasheets and manufacturer documentation for Texas Instruments TL16C2550IPFB
Datasheet:
TL16C2550IPFB,

Texas Instruments TL16C2550IPFB Environmental and export classification status description
The TL16C2550IPFB is a dual UART with 16-byte FIFOs (First-In-First-Out) integrated circuits designed to be compatible with 16C550-type devices and the industry-standard 16C450. It features 128-byte transmit and receive FIFOs to support higher data rates and reduce processor overhead. This IC also supports IrDA (Infrared Data Association) communication. Functions: - Dual UART functionality - 16-byte FIFO for each channel - 128-byte transmit and receive FIFOs - IrDA communication support - Compatible with 16C550 and 16C450 standards Applications: - Industrial automation - Embedded systems - Telecommunications equipment - Networking devices - POS (Point of Sale) terminals - Test and measurement equipment Alternative Components: - MAX3100: Full-duplex UART with 128-byte FIFOs - SC16IS750: Single-channel UART with SPI interface - CY7C65213: USB-to-UART bridge controller - XR17V352: Dual-channel PCI Express UART Embedded Modules: - Microcontrollers with built-in UART peripherals, such as STM32 series - FPGA (Field-Programmable Gate Array) with configurable UART IP cores - Communication modules like Wi-Fi or Bluetooth modules with UART interface Related Q&A: 1. What is the maximum baud rate supported by the TL16C2550IPFB? 2. Can the TL16C2550IPFB be used in systems requiring low power consumption? 3. How does the TL16C2550IPFB manage data flow with its FIFO buffers? 4. Are there any specific ESD (Electrostatic Discharge) protection measures for handling the TL16C2550IPFB? 5. Can the TL16C2550IPFB interface directly with RS-485 communication?

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TL16C2550IPFB provided by Texas Instruments

Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips. TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems. We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.