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Texas Instruments THS789PFD
Manufacturer # :THS789PFD
Manufacturer :Texas Instruments
Dasenic # :THS789PFD-DS
Datasheet : THS789PFD Datasheet
Customer # :
Description : IC TIME MEASUREMNT UNIT 100HTQFP
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In Stock: 5940
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 117.837
Total :$ 117.84
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THS789PFD information
Texas Instruments THS789PFD technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Clock/Timing - Application Specific
- Product Status:Not For New Designs
- Operating Temperature:0°C ~ 70°C
- Mounting Type:Surface Mount
- Package / Case:100-TQFP Exposed Pad
- Supplier Device Package:100-HTQFP (14x14)
- Frequency - Max:200MHz
- Number of Circuits:1
- Output:LVDS
- Voltage - Supply:3.135V ~ 3.465V
- P L L:Yes
- Input:LVCMOS, LVDS
- Ratio - Input: Output:5:9
- Differential - Input: Output:Yes/Yes
- Main Purpose:Time Measurement
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:4 (72 Hours)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
THS789PFD provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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