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Texas Instruments THS6226IRHBT
Manufacturer # :THS6226IRHBT
Manufacturer :Texas Instruments
Dasenic # :THS6226IRHBT-DS
Datasheet : THS6226IRHBT Datasheet
Customer # :
Description : Class H, Fixed Gain VDSL2 Dual Port Low-Power xDSL and PLC Line Driver
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In Stock: 4224
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.3824
Total :$ 1.38
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THS6226IRHBT information
Texas Instruments THS6226IRHBT technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Interface - Telecom
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 85°C
- Mounting Type:Surface Mount
- Package / Case:32-VFQFN Exposed Pad
- Current - Supply:23.5mA
- Functions:VDSL2 Line Driver Amplifier
- Interface:Serial
- Supplier Device Package:32-VQFN (5x5)
- Number of Circuits:2
- Voltage - Supply:10V ~ 12.5V
- Base Product Number:THS6226
- Packaging:Tape & Reel (TR)
- Packaging:Cut Tape (CT)
- Packaging:Dasenic-Reel®
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.33.0001
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
THS6226IRHBT provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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