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Texas Instruments THS6214IRHFR
Manufacturer # :THS6214IRHFR
Manufacturer :Texas Instruments
Dasenic # :THS6214IRHFR-DS
Datasheet : THS6214IRHFR Datasheet
Customer # :
Description : High Speed, Dual Port, Differential DSL Line Driver Amplifier
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In Stock: 11130
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 3.753
Total :$ 3.75
Delivery :
Payment :
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THS6214IRHFR information
Texas Instruments THS6214IRHFR technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Interface - Telecom
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C
- Mounting Type:Surface Mount
- Package / Case:24-VFQFN Exposed Pad
- Functions:VDSL2 Line Driver Amplifier
- Supplier Device Package:24-VQFN (5x4)
- Number of Circuits:2
- Voltage - Supply:10V ~ 28V
- Base Product Number:THS6214
- Packaging:Tape & Reel (TR)
- Packaging:Cut Tape (CT)
- Packaging:Dasenic-Reel®
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:2 (1 Year,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.33.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
THS6214IRHFR provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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