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Texas Instruments THS4131CDGN
Manufacturer # :THS4131CDGN
Manufacturer :Texas Instruments
Dasenic # :THS4131CDGN-DS
Datasheet : THS4131CDGN Datasheet
Customer # :
Description : IC OPAMP DIFF 1 CIRCUIT 8HVSSOP
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In Stock: 3960
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 5.3037
Total :$ 5.30
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THS4131CDGN information
Texas Instruments THS4131CDGN technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps
- Product Status:Active
- Operating Temperature:0°C ~ 70°C
- Mounting Type:Surface Mount
- Package / Case:8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Exposed Pad
- Current - Supply:12.3mA
- Output Type:Differential
- Supplier Device Package:8-HVSSOP
- Number of Circuits:1
- Amplifier Type:Differential
- -3db Bandwidth:150 MHz
- Current - Output / Channel:85 mA
- Slew Rate:52V/µs
- Gain Bandwidth Product:225 MHz
- Current - Input Bias:2 µA
- Voltage - Input Offset:200 µV
- Voltage - Supply Span ( Min):4 V
- Voltage - Supply Span ( Max):33 V
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.33.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
THS4131CDGN provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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