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Texas Instruments TCAN4551RGYRQ1

CAN-FD TO SPI
part number has RoHS
Manufacturer # :TCAN4551RGYRQ1
Manufacturer :Texas Instruments
Dasenic # :TCAN4551RGYRQ1-DS
Customer # :
Description : CAN-FD TO SPI
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 2.2590$ 2.26
10+$ 1.5390$ 15.39
100+$ 1.3770$ 137.7
250+$ 1.3050$ 326.25
500+$ 1.2600$ 630
In Stock: 18000
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 2.259
Total :$ 2.26
Delivery :
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Payment :
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TCAN4551RGYRQ1 information

  • Texas Instruments TCAN4551RGYRQ1 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Specialized ICs
  • Product Status:Active
  • Mounting Type:Surface Mount, Wettable Flank
  • Package / Case:20-VFQFN Exposed Pad
  • Type:CAN FD Controller
  • Supplier Device Package:20-VQFN (3.5x4.5)
  • Applications:-
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
TCAN4551RGYRQ1 provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips. TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems. We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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