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Texas Instruments TCAN334GDCNR
Manufacturer # :TCAN334GDCNR
Manufacturer :Texas Instruments
Dasenic # :TCAN334GDCNR-DS
Datasheet : TCAN334GDCNR Datasheet
Customer # :
Description : 3.3-V CAN Transceivers with CAN FD (Flexible Data Rate)
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In Stock: 10199
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 2.61
Total :$ 2.61
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TCAN334GDCNR information
Texas Instruments TCAN334GDCNR technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Interface - Drivers, Receivers, Transceivers
- Product Status:Active
- Operating Temperature:-40°C ~ 125°C
- Mounting Type:Surface Mount
- Package / Case:SOT-23-8
- Type:Transceiver
- Supplier Device Package:SOT-23-8
- Voltage - Supply:3V ~ 3.6V
- Protocol:CANbus
- Number of Drivers/ Receivers:1/1
- Receiver Hysteresis:120 mV
- Data Rate:5Mbps
- Base Product Number:TCAN334
- Packaging:Tape & Reel (TR)
- Packaging:Cut Tape (CT)
- Packaging:Dasenic-Reel®
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
TCAN334GDCNR provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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