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Texas Instruments TCA9555RTWR
Manufacturer # :TCA9555RTWR
Manufacturer :Texas Instruments
Dasenic # :TCA9555RTWR-DS
Datasheet : TCA9555RTWR Datasheet
Customer # :
Description : IC I/O EXPANDER I2C 16B 24WQFN
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In Stock: 6847
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.6363
Total :$ 0.64
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TCA9555RTWR information
Texas Instruments TCA9555RTWR technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Interface - I/O Expanders
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C
- Features:POR
- Mounting Type:Surface Mount
- Package / Case:24-WFQFN Exposed Pad
- Output Type:Push-Pull
- Interface:I²C, SMBus
- Supplier Device Package:24-WQFN (4x4)
- Voltage - Supply:1.65V ~ 5.5V
- Number of I/ O:16
- Interrupt Output:Yes
- Current - Output Source/ Sink:10mA, 25mA
- Clock Frequency:400 kHz
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
TCA9555RTWR provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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