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Texas Instruments TAS3103ADBTG4

IC AUDIO SIGNAL PROCESSR 38TSSOP
part number has RoHS
Manufacturer # :TAS3103ADBTG4
Manufacturer :Texas Instruments
Dasenic # :TAS3103ADBTG4-DS
Customer # :
Description : IC AUDIO SIGNAL PROCESSR 38TSSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
50+$ 16.8864$ 844.32
In Stock: 1798
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 16.8864
Total :$ 16.89
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TAS3103ADBTG4 information

  • Texas Instruments TAS3103ADBTG4 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Audio Special Purpose
  • Application:Digital Audio Interfacing
  • Package / Case:38-TFSOP (0.173, 4.40mm Width)
  • Functions:Audio Signal Processor
  • Interface:I²C
  • Operating Temperature:0°C ~ 70°C (TA)
  • Voltage- Supply:3V ~ 3.6V
  • Numberof Channels:3
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • US ECCN:Provided as per user requirements
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
TAS3103ADBTG4 provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips. TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems. We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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