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  • Texas Instruments STSB43AB23PDT

    IC PHY/LINK LAYER CTRLR 128-TQFP
  • part number has RoHS
  • Mfr.Part # :STSB43AB23PDT
  • Manufacturer :Texas Instruments
  • Dasenic # :STSB43AB23PDT-DS
  • Datasheet :pdf download STSB43AB23PDT Datasheet
  • Description : IC PHY/LINK LAYER CTRLR 128-TQFP
  • Package :-
  • Quantity :
    Unit Price : $ 8.7066Total : $ 8.71
  • Delivery Time :Ship Within 48 Hours
  • Shipping Origin :Shenzhen or Hong Kong Warehouse
  • Delivery :
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In Stock: 28080
( MOQ : 1 PCS )
Pricing (USD) : * All prices are in USD
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1 +$ 8.7066$ 8.71

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Texas Instruments STSB43AB23PDT technical specifications, attributes, parameters.
Category:Integrated Circuits (ICs)/Controllers Interface
Product Status:Obsolete
Operating Temperature:0°C ~ 70°C
Package / Case:128-TQFP
Current - Supply:-
Interface:PCI
Supplier Device Package:128-TQFP (14x14)
Standards:IEEE 1394a-2000, OHCI, FireWire, i.LINK
Voltage - Supply:3V ~ 3.6V
Protocol:IEEE 1394
Function:Physical Layer Controller
EU RoHS Status:ROHS3 Compliant
MSL Rating:1 (Unlimited, 30°C/85%RH)
REACH Status:REACH Unaffected
US ECCN:EAR99
HTS US:8542.39.0001
China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
STSB43AB23PDT provided by Texas Instruments

Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.

TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.

We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.

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