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Texas Instruments SRC4193IDBG4
Manufacturer # :SRC4193IDBG4
Manufacturer :Texas Instruments
Dasenic # :SRC4193IDBG4-DS
Datasheet : SRC4193IDBG4 Datasheet
Customer # :
Description : IC 192KHZ SAMPL RATE CONV 28SSOP
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In Stock: 1525
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 5.832
Total :$ 5.83
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SRC4193IDBG4 information
Texas Instruments SRC4193IDBG4 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Audio Special Purpose
- Product Status:Active
- Operating Temperature:-45°C ~ 85°C (TA)
- Application:Digital Audio Interfacing
- Mounting Type:Surface Mount
- Package / Case:28-SSOP (0.209", 5.30mm Width)
- Functions:Sample Rate Converter
- Number of Channels:2
- Interface:I²S, TDM
- Specifications:4kHz ~ 212kHz
- Supplier Device Package:28-SSOP
- Voltage - Supply:3.3V
- Base Product Number:SRC419
- Packaging:Tube
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
SRC4193IDBG4 provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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