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Texas Instruments SN75LVCP422DBR
Manufacturer # :SN75LVCP422DBR
Manufacturer :Texas Instruments
Dasenic # :SN75LVCP422DBR-DS
Datasheet : SN75LVCP422DBR Datasheet
Customer # :
Description : IC REDRIVER ESATA 2CH 20SSOP
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In Stock: 11970
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.845
Total :$ 1.84
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SN75LVCP422DBR information
Texas Instruments SN75LVCP422DBR technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Interface - Signal Buffers, Repeaters, Splitters
- Product Status:Active
- Operating Temperature:0°C ~ 85°C
- Mounting Type:Surface Mount
- Package / Case:20-SSOP (0.209", 5.30mm Width)
- Current - Supply:55mA
- Type:Buffer, ReDriver
- Number of Channels:2
- Supplier Device Package:20-SSOP
- Data Rate ( Max):3Gbps
- Output:-
- Voltage - Supply:3V ~ 3.6V
- Input:-
- Delay Time:300ps
- Signal Conditioning:Input Equalization, Output Pre-Emphasis
- Capacitance - Input:-
- Applications:eSATA
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
SN75LVCP422DBR provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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