Name: SN75LBC031D
Brand: Texas Instruments
SKU: DS-5699517
Price: 2.835 USD
Availability: InStock
Rating: 4.8 (3 reviews)

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1 : $2.8350

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Texas Instruments SN75LBC031D

IC TRANSCEIVER HALF 1/1 8SOIC

Manufacturer # :SN75LBC031D

Manufacturer :Texas Instruments

Dasenic # :SN75LBC031D-DS

Datasheet :

SN75LBC031D Datasheet

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Description : IC TRANSCEIVER HALF 1/1 8SOIC

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Quantity	Unit Price	Total
1+	$ 2.8350	$ 2.84
25+	$ 2.7810	$ 69.53
100+	$ 2.6640	$ 266.4
500+	$ 2.5470	$ 1273.5
1000+	$ 2.4120	$ 2412

In Stock: 1793

MOQ :1 PCS

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Delivery Time :Ship Within 48 Hours

Shipping Origin :Shenzhen or Hong Kong Warehouse

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Unit Price :$ 2.835

Total :$ 2.83

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SN75LBC031D information

Texas Instruments SN75LBC031D technical specifications, attributes, parameters.
Category:Integrated Circuits (ICs)/Interface - Drivers, Receivers, Transceivers
Product Status:Active
Operating Temperature:-40°C ~ 85°C
Mounting Type:Surface Mount
Package / Case:8-SOIC (0.154", 3.90mm Width)
Type:Transceiver
Supplier Device Package:8-SOIC
Voltage - Supply:4.5V ~ 5.5V
Protocol:CANbus
Number of Drivers/ Receivers:1/1
Duplex:Half
Receiver Hysteresis:180 mV
Data Rate:-
EU RoHS Status:RoHS Compliant
REACH Status:REACH is not affected
US ECCN:EAR99
China RoHS Status:Green Symbol: Green and environmentally friendly product

Download datasheets and manufacturer documentation for Texas Instruments SN75LBC031D
Datasheet:
SN75LBC031D,

Texas Instruments SN75LBC031D Environmental and export classification status description
The Texas Instruments SN75LBC031D is a differential driver and receiver integrated circuit commonly used in communication systems. It is part of the SNxxLBC series of devices designed for data transmission over long distances in noisy environments. Functions: - It provides a differential interface to communicate with other devices. - The driver amplifies and shapes signals for transmission, while the receiver senses and regenerates incoming signals. - It helps in maintaining signal integrity by reducing electromagnetic interference. Applications: - Industrial automation systems - Motor control systems - Building automation - Communication systems - Automotive networks - Robotics Alternative Components: - MAX485 from Maxim Integrated - SN65HVD11 from Texas Instruments - LTC2862 from Analog Devices Embedded Modules: - Arduino RS485 modules - Raspberry Pi RS485 modules - BeagleBone RS485 modules Q&A: 1. What is the maximum data rate supported by the SN75LBC031D? The SN75LBC031D supports data rates up to 20 Mbps. 2. Can the SN75LBC031D operate in harsh industrial environments? Yes, the SN75LBC031D is designed to operate in harsh industrial environments with its robust build and noise immunity characteristics. 3. How many differential channels are there in the SN75LBC031D? The SN75LBC031D provides one differential driver and one differential receiver channel. 4. Does the SN75LBC031D require external components for operation? Yes, the SN75LBC031D may require external components such as resistors and capacitors for proper configuration and functionality. 5. Can the SN75LBC031D be used for half-duplex communication? Yes, the SN75LBC031D can be configured for half-duplex communication where data transmission can happen in both directions, but not simultaneously.

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SN75LBC031D provided by Texas Instruments

Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips. TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems. We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.