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  • Texas Instruments SN74V293-7GGM

    IC SYNC FIFO MEM 65536X18 100BGA
  • part number has RoHS
  • Mfr.Part # :SN74V293-7GGM
  • Manufacturer :Texas Instruments
  • Dasenic # :SN74V293-7GGM-DS
  • Datasheet :pdf download SN74V293-7GGM Datasheet
  • Description : IC SYNC FIFO MEM 65536X18 100BGA
  • Package :-
  • Quantity :
    Unit Price : $ 72.6067Total : $ 72.61
  • Delivery Time :Ship Within 48 Hours
  • Shipping Origin :Shenzhen or Hong Kong Warehouse
  • Delivery :
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In Stock: 1744
( MOQ : 1 PCS )
Pricing (USD) : * All prices are in USD
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184 +$ 72.6067$ 13359.63

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Texas Instruments SN74V293-7GGM technical specifications, attributes, parameters.
Category:Integrated Circuits (ICs)/FIFOs Memory
Product Status:Obsolete
Operating Temperature:0°C ~ 70°C
Mounting Type:Surface Mount
Package / Case:100-LFBGA
Supplier Device Package:100-BGA MICROSTAR (10x10)
Memory Size:1.125M (64K x 18)(128K x 9)
Voltage - Supply:3.15 V ~ 3.45 V
Current - Supply ( Max):35mA
Data Rate:133MHz
Access Time:5ns
Bus Directional:Uni-Directional
Expansion Type:Depth, Width
Programmable Flags Support:Yes
Retransmit Capability:Yes
F W F T Support:Yes
Function:Synchronous
EU RoHS Status:ROHS3 Compliant
MSL Rating:3 (168 Hours,30°C/60%RH)
REACH Status:REACH Unaffected
US ECCN:3A991B2B
HTS US:8542.39.0001
China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
SN74V293-7GGM provided by Texas Instruments

Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.

TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.

We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.

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