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Texas Instruments SN74V283-7GGM
Manufacturer # :SN74V283-7GGM
Manufacturer :Texas Instruments
Dasenic # :SN74V283-7GGM-DS
Datasheet : SN74V283-7GGM Datasheet
Customer # :
Description : IC SYNC FIFO MEM 32768X18 100BGA
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In Stock: 2776
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 68.6442
Total :$ 68.64
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SN74V283-7GGM information
Texas Instruments SN74V283-7GGM technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Logic - FIFOs Memory
- Product Status:Obsolete
- Operating Temperature:0°C ~ 70°C
- Mounting Type:Surface Mount
- Package / Case:100-LFBGA
- Supplier Device Package:100-BGA MICROSTAR (10x10)
- Memory Size:576K (32K x 18)(64K x 9)
- Voltage - Supply:3.15 V ~ 3.45 V
- Current - Supply ( Max):35mA
- Data Rate:133MHz
- Access Time:5ns
- Bus Directional:Uni-Directional
- Expansion Type:Depth, Width
- Programmable Flags Support:Yes
- Retransmit Capability:Yes
- F W F T Support:Yes
- Function:Synchronous
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:3A991B2B
- HTS US:8542.39.0001
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
SN74V283-7GGM provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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