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Texas Instruments SN74SSTV32867GKER

IC REGISTERED BUFF 26BIT 96LFBGA
part number has RoHS
Manufacturer # :SN74SSTV32867GKER
Manufacturer :Texas Instruments
Dasenic # :SN74SSTV32867GKER-DS
Customer # :
Description : IC REGISTERED BUFF 26BIT 96LFBGA
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 5.3820$ 5.38
25+$ 5.2740$ 131.85
100+$ 5.0580$ 505.8
500+$ 4.8420$ 2421
1000+$ 4.5720$ 4572
In Stock: 6000
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 5.382
Total :$ 5.38
Delivery :
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SN74SSTV32867GKER information

  • Texas Instruments SN74SSTV32867GKER technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Logic - Specialty Logic
  • Product Status:Obsolete
  • Operating Temperature:0°C ~ 70°C
  • Mounting Type:Surface Mount
  • Package / Case:96-LFBGA
  • Supplier Device Package:96-LFBGA (13.5x5.5)
  • Supply Voltage:2.3V ~ 2.7V
  • Number of Bits:26
  • Logic Type:Registered Buffer with SSTL_2 Compatible I/O for DDR
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:3 (168 Hours,30°C/60%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
SN74SSTV32867GKER provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips. TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems. We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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