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  • Texas Instruments SN74S132DE4

    IC GATE NAND 4CH 2-INP 14SOIC
  • part number has RoHS
  • Mfr.Part # :SN74S132DE4
  • Manufacturer :Texas Instruments
  • Dasenic # :SN74S132DE4-DS
  • Datasheet :pdf download SN74S132DE4 Datasheet
  • Description : IC GATE NAND 4CH 2-INP 14SOIC
  • Package :-
  • Quantity :
    Unit Price : $ 2.286Total : $ 2.29
  • Delivery Time :Ship Within 48 Hours
  • Shipping Origin :Shenzhen or Hong Kong Warehouse
  • Delivery :
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  • Payment :
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In Stock: 8780
( MOQ : 1 PCS )
Pricing (USD) : * All prices are in USD
QuantityUnit PriceTotal
1 +$ 2.2860$ 2.29

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Texas Instruments SN74S132DE4 technical specifications, attributes, parameters.
Category:Integrated Circuits (ICs)/Gates and Inverters
Product Status:Obsolete
Operating Temperature:0°C ~ 70°C
Features:Schmitt Trigger
Mounting Type:Surface Mount
Package / Case:14-SOIC (0.154", 3.90mm Width)
Supplier Device Package:14-SOIC
Number of Circuits:4
Voltage - Supply:4.75V ~ 5.25V
Number of Inputs:2
Current - Quiescent ( Max):-
Logic Type:NAND Gate
Current - Output High, Low:1mA, 20mA
Max Propagation Delay @ V, Max C L:13ns @ 5V, 15pF
Logic Level - Low:1.1V
Logic Level - High:1.9V
EU RoHS Status:RoHS Compliant
REACH Status:Vendor is not defined
US ECCN:Provided as per user requirements
China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
SN74S132DE4 provided by Texas Instruments

Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.

TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.

We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.

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