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Texas Instruments SN74LVTH16374DGG
Manufacturer # :SN74LVTH16374DGG
Manufacturer :Texas Instruments
Dasenic # :SN74LVTH16374DGG-DS
Datasheet : SN74LVTH16374DGG Datasheet
Customer # :
Description : IC FF D-TYPE DUAL 8BIT 48TSSOP
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In Stock: 5304
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 28.8389
Total :$ 28.84
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SN74LVTH16374DGG information
Texas Instruments SN74LVTH16374DGG technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Logic - Flip Flops
- Product Status:Active
- Type:D-Type
- Functions:Standard
- Supplier Device Package:48-TSSOP
- Series:74LVTH
- Operating Temperature:-40°C ~ 85°C (TA)
- Voltage- Supply:2.7V ~ 3.6V
- Output Type:Tri-State, Non-Inverted
- Clock Frequency:160 MHz
- Numberof Elements:2
- Current- Output High Low:32mA, 64mA
- Numberof Bitsper Element:8
- Current- Quiescent( Iq):5 mA
- Max Propagation Delay@ V Max C L:4.5ns @ 3.3V, 50pF
- Trigger Type:Positive Edge
- Input Capacitance:3 pF
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
SN74LVTH16374DGG provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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