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Texas Instruments SN74LVC2G53DCU3
Manufacturer # :SN74LVC2G53DCU3
Manufacturer :Texas Instruments
Dasenic # :SN74LVC2G53DCU3-DS
Datasheet : SN74LVC2G53DCU3 Datasheet
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Description : 5-V, 2:1 (SPDT), 1-channel general-purpose analog switch (available in the NanoFree™ package)
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In Stock: 13259
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
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Unit Price :$ 0.009
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SN74LVC2G53DCU3 information
Texas Instruments SN74LVC2G53DCU3 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Interface - Analog Switches, Multiplexers, Demultiplexers
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C (TA)
- Mounting Type:Surface Mount
- Package / Case:8-VFSOP (0.091", 2.30mm Width)
- Supplier Device Package:8-VSSOP
- Number of Circuits:1
- Multiplexer/ Demultiplexer Circuit:2:1
- Switch Circuit:SPDT
- On- State Resistance ( Max):13Ohm
- Voltage - Supply, Single ( V+):1.65V ~ 5.5V
- -3db Bandwidth:300MHz
- Switch Time ( Ton, Toff) ( Max):4.5ns, 8ns
- Channel Capacitance ( C S(off), C D(off)):10pF
- Current - Leakage ( I S(off)) ( Max):1µA
- Crosstalk:-58dB @ 1MHz
- Series:74LVC
- Channel-to- Channel Matching (& Delta; Ron):2Ohm (Max)
- Packaging:Bulk
- EU RoHS Status:ROHS3 Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
SN74LVC2G53DCU3 provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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