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Texas Instruments SN74LVC1G79DCKR
Manufacturer # :SN74LVC1G79DCKR
Manufacturer :Texas Instruments
Dasenic # :SN74LVC1G79DCKR-DS
Datasheet : SN74LVC1G79DCKR Datasheet
Customer # :
Description : IC FF D-TYPE SNGL 1BIT SC70-5
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In Stock: 20521
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
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SN74LVC1G79DCKR information
Texas Instruments SN74LVC1G79DCKR technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Logic - Flip Flops
- Product Status:Active
- Operating Temperature:-40°C ~ 125°C (TA)
- Mounting Type:Surface Mount
- Package / Case:5-TSSOP, SC-70-5, SOT-353
- Type:D-Type
- Output Type:Non-Inverted
- Supplier Device Package:SC-70-5
- Number of Elements:1
- Voltage - Supply:1.65V ~ 5.5V
- Clock Frequency:160 MHz
- Number of Bits per Element:1
- Current - Output High, Low:32mA, 32mA
- Max Propagation Delay @ V, Max C L:4.5ns @ 5V, 50pF
- Current - Quiescent ( Iq):10 µA
- Trigger Type:Positive Edge
- Input Capacitance:4 pF
- Function:Standard
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
SN74LVC1G79DCKR provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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