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Texas Instruments SN74LVC1G57DRY2
Manufacturer # :SN74LVC1G57DRY2
Manufacturer :Texas Instruments
Dasenic # :SN74LVC1G57DRY2-DS
Datasheet : SN74LVC1G57DRY2 Datasheet
Customer # :
Description : IC CONFIG MULTI-FUNC GATE 6SON
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In Stock: 7558
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
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Unit Price :$ 0.0375
Total :$ 0.04
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SN74LVC1G57DRY2 information
Texas Instruments SN74LVC1G57DRY2 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Logic - Gates and Inverters - Multi-Function, Configurable
- Product Status:Active
- Operating Temperature:-40°C ~ 125°C
- Mounting Type:Surface Mount
- Package / Case:6-UFDFN
- Output Type:Single-Ended
- Supplier Device Package:6-SON (1.45x1)
- Number of Circuits:1
- Voltage - Supply:1.65V ~ 5.5V
- Number of Inputs:3
- Logic Type:Configurable Multiple Function
- Current - Output High, Low:32mA, 32mA
- Schmitt Trigger Input:No
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
SN74LVC1G57DRY2 provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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