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Texas Instruments SN74LVC1G3157YZPR
Manufacturer # :SN74LVC1G3157YZPR
Manufacturer :Texas Instruments
Dasenic # :SN74LVC1G3157YZPR-DS
Datasheet : SN74LVC1G3157YZPR Datasheet
Customer # :
Description : IC SWITCH SPDT 6DSBGA
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In Stock: 29587
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.125
Total :$ 0.13
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SN74LVC1G3157YZPR information
Texas Instruments SN74LVC1G3157YZPR technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Interface - Analog Switches, Multiplexers, Demultiplexers
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C (TA)
- Mounting Type:Surface Mount
- Package / Case:6-XFBGA, DSBGA
- Supplier Device Package:6-DSBGA (1.39x.89)
- Number of Circuits:1
- Multiplexer/ Demultiplexer Circuit:2:1
- Switch Circuit:SPDT
- On- State Resistance ( Max):15Ohm
- Voltage - Supply, Single ( V+):1.65V ~ 5.5V
- Voltage - Supply, Dual ( V±):-
- -3db Bandwidth:340MHz
- Channel-to- Channel Matching (Δ Ron):100mOhm
- Switch Time ( Ton, Toff) ( Max):5.7ns, 3.8ns
- Charge Injection:7pC
- Channel Capacitance ( C S(off), C D(off)):5.2pF
- Current - Leakage ( I S(off)) ( Max):1µA
- Crosstalk:-54dB @ 10MHz
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
SN74LVC1G3157YZPR provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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